Granted Patent
Utility
US 5,698,242 · App. 08/580,070
Apparatus for the injection molding of semiconductor elements
Inventors:
Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan
Patented Case
View Patent ↗
Granted: Dec 16, 1997
Filed: Dec 20, 1995
Inventors
Eugene Chen
Hohn Jong Hsiung
Kuang Hann Lin
Wing Lun Wong
Boon Meng Chan
Assignees (at issue)
General Instrument Corporation of Delaware
Kras Asia Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.