Granted Patent
Utility
US 5,700,348 · App. 08/758,761
Method of polishing semiconductor substrate
Inventor:
Michio Sakurai
Patented Case
View Patent ↗
Granted: Dec 23, 1997
Filed: Dec 3, 1996
Inventor
Michio Sakurai
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.