Granted Patent
Utility
US 5,700,697 · App. 08/471,739
Method for packaging an integrated circuit using a reconstructed package
Inventor:
Joseph J. Dlugokecki
Patented Case
View Patent ↗
Granted: Dec 23, 1997
Filed: Jun 6, 1995
Inventor
Joseph J. Dlugokecki
Assignee (at issue)
Silicon Packaging Technology
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.