Granted Patent
Utility
US 5,700,721 · App. 08/658,041
Structure and method for metallization of semiconductor devices
Inventors:
Hank Hukyoo Shin, Clarence J. Tracy, Robert L. Duffin, John L. Freeman, Jr., Gordon M. Grivna, Syd R. Wilson
Patented Case
View Patent ↗
Granted: Dec 23, 1997
Filed: Jun 4, 1996
Inventors
Hank Hukyoo Shin
Clarence J. Tracy
Robert L. Duffin
John L. Freeman, Jr.
Gordon M. Grivna
Syd R. Wilson
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.