Granted Patent
Utility
US 5,701,034 · App. 08/237,709
Packaged semiconductor die including heat sink with locking feature
Inventor:
Robert C. Marrs
Patented Case
View Patent ↗
Granted: Dec 23, 1997
Filed: May 3, 1994
Inventor
Robert C. Marrs
Assignee (at issue)
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.