Granted Patent
Utility
US 5,701,037 · App. 08/549,068
Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit
Inventors:
Werner Weber, Stefan Kuehn, Michael Kleiner, Roland Thewes
Patented Case
View Patent ↗
Granted: Dec 23, 1997
Filed: Oct 27, 1995
Inventors
Werner Weber
Stefan Kuehn
Michael Kleiner
Roland Thewes
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.