Granted Patent
Utility
US 5,701,085 · App. 08/498,791
Apparatus for testing flip chip or wire bond integrated circuits
Inventors:
Deviprasad Malladi, Lee Hanson, Jean Kahahane
Patented Case
View Patent ↗
Granted: Dec 23, 1997
Filed: Jul 5, 1995
Inventors
Deviprasad Malladi
Lee Hanson
Jean Kahahane
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.