Granted Patent
Utility
US 5,707,664 · App. 08/692,707
Heated nozzle manifolds in a common plane interconnected through connector manifolds
Inventor:
Chun Keung Mak
Patented Case
View Patent ↗
Granted: Jan 13, 1998
Filed: Aug 6, 1996
Inventor
Chun Keung Mak
Assignee (at issue)
Mold-Masters Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.