Granted Patent
Utility
US 5,708,293 · App. 08/777,495
Lead frame and method of mounting semiconductor chip
Inventors:
Takao Ochi, Hisashi Funakoshi, Ichiro Okumura, Hajime Honma, Keiji Okuma, Keiichi Fujimoto
Patented Case
View Patent ↗
Granted: Jan 13, 1998
Filed: Dec 30, 1996
Inventors
Takao Ochi
Hisashi Funakoshi
Ichiro Okumura
Hajime Honma
Keiji Okuma
Keiichi Fujimoto
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.