IP Library Granted Patent US 5,708,294
Granted Patent Utility
US 5,708,294 · App. 08/605,497

Lead frame having oblique slits on a die pad

Inventor: Keiji Toriyama
Patented Case View Patent ↗
Granted: Jan 13, 1998 Filed: Feb 26, 1996
Inventor
Keiji Toriyama
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,708,294
App. No.
08/605,497
Filed
1996-02-26
Granted
1998-01-13
Kind
A