Granted Patent
Utility
US 5,708,295 · App. 08/638,043
Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same
Inventors:
Akira Oga, Yukio Yamaguchi, Toru Nomura, Masanori Minamio
Patented Case
View Patent ↗
Granted: Jan 13, 1998
Filed: Apr 26, 1996
Inventors
Akira Oga
Yukio Yamaguchi
Toru Nomura
Masanori Minamio
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.