Granted Patent
Utility
US 5,716,449 · App. 08/486,925
Method of forming a compound semiconductor material
Inventor:
Paul Klocek
Patented Case
View Patent ↗
Granted: Feb 10, 1998
Filed: Jun 7, 1995
Inventor
Paul Klocek
Assignee (at issue)
Texas Instruments Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.