Granted Patent
Utility
US 5,722,161 · App. 08/641,603
Method of making a packaged semiconductor die including heat sink with locking feature
Inventor:
Robert C. Marrs
Patented Case
View Patent ↗
Granted: Mar 3, 1998
Filed: May 1, 1996
Inventor
Robert C. Marrs
Assignee (at issue)
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.