Granted Patent
Utility
US 5,723,359 · App. 08/764,697
Method for concurrently forming thin film resistor and thick film resistor on a hybrid integrated circuit substrate
Inventor:
Kyung Hwan Lee
Patented Case
View Patent ↗
Granted: Mar 3, 1998
Filed: Dec 11, 1996
Inventor
Kyung Hwan Lee
Assignee (at issue)
LG Information & Communications, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.