Granted Patent
Utility
US 5,727,458 · App. 08/619,807
Method and apparatus for contour multi-level embossing with perforation bonding in selected spaced locations
Inventor:
Galyn A. Schulz
Patented Case
View Patent ↗
Granted: Mar 17, 1998
Filed: Mar 20, 1996
Inventor
Galyn A. Schulz
Assignee (at issue)
JAMES RIVER CORPORATION OF VIRGINIA
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.