Granted Patent
Utility
US 5,729,432 · App. 08/588,172
Ball grid array semiconductor package with improved heat dissipation and dehumidification effect
Inventors:
Il Kwon Shim, Young Wook Heo
Patented Case
View Patent ↗
Granted: Mar 17, 1998
Filed: Jan 18, 1996
Inventors
Il Kwon Shim
Young Wook Heo
Assignees (at issue)
Anam Industrial Co., Ltd.
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.