Granted Patent
Utility
US 5,740,956 · App. 08/570,849
Bonding method for semiconductor chips
Inventors:
Seong Min Seo, Suck Ju Jang
Patented Case
View Patent ↗
Granted: Apr 21, 1998
Filed: Dec 12, 1995
Inventors
Seong Min Seo
Suck Ju Jang
Assignees (at issue)
Anam Industrial Co., Ltd.
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.