Granted Patent
Utility
US 5,741,530 · App. 08/591,361
Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips
Inventor:
Youichi Tsunoda
Patented Case
View Patent ↗
Granted: Apr 21, 1998
Filed: Jan 25, 1996
Inventor
Youichi Tsunoda
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.