Granted Patent
Utility
US 5,743,459 · App. 08/543,625
Method for fabricating semiconductor device with step of bonding lead frame leads to chip pads
Inventor:
Michitaka Urushima
Patented Case
View Patent ↗
Granted: Apr 28, 1998
Filed: Oct 16, 1995
Inventor
Michitaka Urushima
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.