IP Library Granted Patent US 5,744,192
Granted Patent Utility
US 5,744,192 · App. 08/745,562

Method of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVS

Inventors: Tue Nguyen, Yoshihide Senzaki, Masato Kobayashi, Lawrence J. Charneski, Sheng Teng Hsu
Patented Case View Patent ↗
Granted: Apr 28, 1998 Filed: Nov 8, 1996
Inventors
Tue Nguyen
Yoshihide Senzaki
Masato Kobayashi
Lawrence J. Charneski
Sheng Teng Hsu
Assignees (at issue)
Sharp Microelectronics Technology Inc.
SHARP KABUSHIKI KAISHA

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Quick Facts
Patent No.
US 5,744,192
App. No.
08/745,562
Filed
1996-11-08
Granted
1998-04-28
Kind
A