Granted Patent
Utility
US 5,744,533 · App. 08/868,508
Adhesive composition for bonding a semiconductor device
Inventors:
Nancy Iwamoto, Jesse L. Pedigo, Shao-Wei Li, Alan Grieve
Patented Case
View Patent ↗
Granted: Apr 28, 1998
Filed: Jun 4, 1997
Inventors
Nancy Iwamoto
Jesse L. Pedigo
Shao-Wei Li
Alan Grieve
Assignee (at issue)
Johnson Matthey Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.