Granted Patent
Utility
US 5,745,986 · App. 08/506,382
Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage
Inventors:
Patrick Variot, Chok J. Chia, Robert T. Trabucco
Patented Case
View Patent ↗
Granted: May 5, 1998
Filed: Jul 24, 1995
Inventors
Patrick Variot
Chok J. Chia
Robert T. Trabucco
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.