Granted Patent
Utility
US 5,748,448 · App. 08/604,416
Solid-state image sensor assembly with image sensor element chip mounted in package
Inventor:
Yasuaki Hokari
Patented Case
View Patent ↗
Granted: May 5, 1998
Filed: Feb 21, 1996
Inventor
Yasuaki Hokari
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.