Granted Patent
Utility
US 5,750,422 · App. 08/394,043
Method for making integrated circuit packaging with reinforced leads
Inventors:
Louis T. Mills, Richard M. Butler, Havyn E. Bradley
Patented Case
View Patent ↗
Granted: May 12, 1998
Filed: Feb 24, 1995
Inventors
Louis T. Mills
Richard M. Butler
Havyn E. Bradley
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.