Granted Patent
Utility
US 5,759,751 · App. 08/795,631
Method of peeling photo-resist layer without damage to metal wiring
Inventors:
Yuji Shimizu, Kohiro Ito, Masashige Moritoki
Patented Case
View Patent ↗
Granted: Jun 2, 1998
Filed: Feb 6, 1997
Inventors
Yuji Shimizu
Kohiro Ito
Masashige Moritoki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.