Granted Patent
Utility
US 5,759,906 · App. 08/827,813
Planarization method for intermetal dielectrics between multilevel interconnections on integrated circuits
Inventor:
Chine-Gie Lou
Patented Case
View Patent ↗
Granted: Jun 2, 1998
Filed: Apr 11, 1997
Inventor
Chine-Gie Lou
Assignee (at issue)
Industrial Technology Research Institute
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.