Granted Patent
Utility
US 5,765,277 · App. 08/723,859
Die bonding apparatus with a revolving pick-up tool
Inventors:
Ho Jin, Sung-Bok Hong, Jae Ky Roh, Hee-Kook Choi
Patented Case
View Patent ↗
Granted: Jun 16, 1998
Filed: Sep 30, 1996
Inventors
Ho Jin
Sung-Bok Hong
Jae Ky Roh
Hee-Kook Choi
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.