Granted Patent
Utility
US 5,766,979 · App. 08/748,113
Wafer level contact sheet and method of assembly
Inventor:
John J. Budnaitis
Patented Case
View Patent ↗
Granted: Jun 16, 1998
Filed: Nov 8, 1996
Inventor
John J. Budnaitis
Assignee (at issue)
W. L. Gore & Associates, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.