Granted Patent
Utility
US 5,767,446 · App. 08/736,107
Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package
Inventors:
Sun Ho Ha, Young Wook Heo
Patented Case
View Patent ↗
Granted: Jun 16, 1998
Filed: Oct 24, 1996
Inventors
Sun Ho Ha
Young Wook Heo
Assignees (at issue)
Anam Industrial Co., Ltd.
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.