Granted Patent
Utility
US 5,770,026 · App. 08/785,694
Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus
Inventor:
Chang Jae Lee
Patented Case
View Patent ↗
Granted: Jun 23, 1998
Filed: Jan 17, 1997
Inventor
Chang Jae Lee
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.