IP Library › Granted Patent US 5,770,477
Granted Patent Utility
US 5,770,477 · App. 08/798,457

Flip chip-on-flip chip multi-chip module

Inventor: Scott D. Brandenburg
Patented Case View Patent ↗
Granted: Jun 23, 1998 Filed: Feb 10, 1997
Inventor
Scott D. Brandenburg
Assignee (at issue)
DELCO ELECTRONICS CORPORATION

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 5,770,477
App. No.
08/798,457
Filed
1997-02-10
Granted
1998-06-23
Kind
A