Granted Patent
Utility
US 5,771,155 · App. 08/707,225
Spring clamp assembly for improving thermal contact between stacked electronic components
Inventor:
Randolph H. Cook
Patented Case
View Patent ↗
Granted: Jun 23, 1998
Filed: Sep 3, 1996
Inventor
Randolph H. Cook
Assignee (at issue)
Aavid Engineering, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.