Granted Patent
Utility
US 5,773,322 · App. 08/884,095
Molded encapsulated electronic component
Inventor:
John D. Weld
Patented Case
View Patent ↗
Granted: Jun 30, 1998
Filed: Jun 27, 1997
Inventor
John D. Weld
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.