Granted Patent
Utility
US 5,773,352 · App. 08/408,959
Fabrication process of bonded total dielectric isolation substrate
Inventor:
Tomohiro Hamajima
Patented Case
View Patent ↗
Granted: Jun 30, 1998
Filed: Mar 23, 1995
Inventor
Tomohiro Hamajima
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.