Granted Patent
Utility
US 5,773,895 · App. 08/627,058
Anchor provisions to prevent mold delamination in an overmolded plastic array package
Inventors:
Altaf Hassan, Bidyut K. Bhattacharyya
Patented Case
View Patent ↗
Granted: Jun 30, 1998
Filed: Apr 3, 1996
Inventors
Altaf Hassan
Bidyut K. Bhattacharyya
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.