IP Library › Granted Patent US 5,776,800
Granted Patent Utility
US 5,776,800 · App. 08/730,536

Paddleless molded plastic semiconductor chip package

Inventors: William Hamburgen, John S. Fitch, Yezdi Dordi
Patented Case View Patent ↗
Granted: Jul 7, 1998 Filed: Oct 11, 1996
Inventors
William Hamburgen
John S. Fitch
Yezdi Dordi

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Quick Facts
Patent No.
US 5,776,800
App. No.
08/730,536
Filed
1996-10-11
Granted
1998-07-07
Kind
A