Granted Patent
Utility
US 5,779,870 · App. 08/422,510
Method of manufacturing laminates and printed circuit boards
Inventor:
D. Eric Seip
Patented Case
View Patent ↗
Granted: Jul 14, 1998
Filed: Apr 13, 1995
Inventor
D. Eric Seip
Assignee (at issue)
Polyclad Laminates, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.