Granted Patent
Utility
US 5,784,262 · App. 08/554,111
Arrangement of pads and through-holes for semiconductor packages
Inventor:
John V. Sherman
Patented Case
View Patent ↗
Granted: Jul 21, 1998
Filed: Nov 6, 1995
Inventor
John V. Sherman
Assignee (at issue)
Symbios, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.