Granted Patent
Utility
US 5,784,264 · App. 08/562,848
MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form
Inventor:
Michinobu Tanioka
Patented Case
View Patent ↗
Granted: Jul 21, 1998
Filed: Nov 27, 1995
Inventor
Michinobu Tanioka
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.