Granted Patent
Utility
US 5,791,549 · App. 08/564,438
Ultrasonic single-point bonder for semiconductor device fabrication
Inventor:
Hiroki Ito
Patented Case
View Patent ↗
Granted: Aug 11, 1998
Filed: Nov 29, 1995
Inventor
Hiroki Ito
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.