Granted Patent
Utility
US 5,796,167 · App. 08/901,134
Semiconductor device with buried wiring layer and fabrication process thereof
Inventor:
Hiroki Koga
Patented Case
View Patent ↗
Granted: Aug 18, 1998
Filed: Jul 28, 1997
Inventor
Hiroki Koga
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.