IP Library › Granted Patent US 5,798,567
Granted Patent Utility
US 5,798,567 · App. 08/915,969

Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors

Inventors: Michael Kelly, Pirooz Emad
Patented Case View Patent ↗
Granted: Aug 25, 1998 Filed: Aug 21, 1997
Inventors
Michael Kelly
Pirooz Emad
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 5,798,567
App. No.
08/915,969
Filed
1997-08-21
Granted
1998-08-25
Kind
A