IP Library › Granted Patent US 5,801,084
Granted Patent Utility
US 5,801,084 · App. 08/843,302

Bonded wafer processing

Inventors: James D. Beasom, Craig J. McLachlan
Patented Case View Patent ↗
Granted: Sep 1, 1998 Filed: Apr 14, 1997
Inventors
James D. Beasom
Craig J. McLachlan
Assignee (at issue)
HARRIS CORPORATION

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Quick Facts
Patent No.
US 5,801,084
App. No.
08/843,302
Filed
1997-04-14
Granted
1998-09-01
Kind
A