Granted Patent
Utility
US 5,801,437 · App. 08/514,294
Three-dimensional warp-resistant integrated circuit module method and apparatus
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Sep 1, 1998
Filed: Aug 11, 1995
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.