Granted Patent
Utility
US 5,803,340 · App. 08/536,592
Composite solder paste for flip chip bumping
Inventors:
Shing Yeh, Bradley H. Carter
Patented Case
View Patent ↗
Granted: Sep 8, 1998
Filed: Sep 29, 1995
Inventors
Shing Yeh
Bradley H. Carter
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.