Granted Patent
Utility
US 5,803,344 · App. 08/709,886
Dual-solder process for enhancing reliability of thick-film hybrid circuits
Inventors:
Anthony John Stankavich, Dwadasi Hare Rama Sarma, Christine Ann Paszkiet, Marion Edmond Ellis
Patented Case
View Patent ↗
Granted: Sep 8, 1998
Filed: Sep 9, 1996
Inventors
Anthony John Stankavich
Dwadasi Hare Rama Sarma
Christine Ann Paszkiet
Marion Edmond Ellis
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.