Granted Patent
Utility
US 5,808,530 · App. 08/610,166
Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal
Inventors:
Ndiata Kalonji, Jack Semo, Jacques Tanniou
Patented Case
View Patent ↗
Granted: Sep 15, 1998
Filed: Feb 29, 1996
Inventors
Ndiata Kalonji
Jack Semo
Jacques Tanniou
Assignee (at issue)
FRANCE TELECOM
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.