Granted Patent
Utility
US 5,814,880 · App. 08/011,094
Thick film copper metallization for microwave power transistor packages
Inventors:
John Costello, Harry Buhay, Richard R. Papania, Prosenjit Rai-Choudhury, Kenneth J. Petrosky, Gene A. Madia
Patented Case
View Patent ↗
Granted: Sep 29, 1998
Filed: Jan 29, 1993
Inventors
John Costello
Harry Buhay
Richard R. Papania
Prosenjit Rai-Choudhury
Kenneth J. Petrosky
Gene A. Madia
Assignee (at issue)
NORTHROP GRUMMAN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.