IP Library › Granted Patent US 5,814,892
Granted Patent Utility
US 5,814,892 · App. 08/660,490

Semiconductor die with staggered bond pads

Inventors: Michael J. Steidl, Sanjay Dandia
Patented Case View Patent ↗
Granted: Sep 29, 1998 Filed: Jun 7, 1996
Inventors
Michael J. Steidl
Sanjay Dandia
Assignee (at issue)
LSI Logic Corporation

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Quick Facts
Patent No.
US 5,814,892
App. No.
08/660,490
Filed
1996-06-07
Granted
1998-09-29
Kind
A