Granted Patent
Utility
US 5,815,372 · App. 08/822,743
Packaging multiple dies on a ball grid array substrate
Inventor:
William N. Gallas
Patented Case
View Patent ↗
Granted: Sep 29, 1998
Filed: Mar 25, 1997
Inventor
William N. Gallas
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.